Seminar
Title: |
Thermomechanical Reliability Evaluations and Analyses of Microelectronic and Electronic Packages |
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Speaker: |
Dr. Charles Ume |
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Affiliation: |
Georgia Tech, Mechanical Engineering |
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When: |
Tuesday, March 30, 2010 at 11:00:00 AM |
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Where: |
MRDC Building, Room 4211 |
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Host: |
Dr. Leon McGinnis | |
Abstract Over the last two decades consumers have been demanding high powered electronic products that are light weight, portable and low cost. In response to consumer demands, the microelectronic and electronic packaging industries started to manufacture thin and small printed wiring boards (PWBs) and densely packed PWB assemblies that go into different types of consumer products. This has resulted in thermo-mechanical reliability related issues such as excessive PWB and chip package warpage/flatness. Excessive PWB or chip warpage causes component misregistration, silicon die cracking, and solder bump failures. Therefore, this presentation will focus on the approach used to develop an integrated Moire and Convective Solder Reflow system for real-time evaluation of PWBs, PWB assemblies and chip package warpage. The experimental results obtained with this system will be presented, and compared with the analytical and finite element modeling results. Also the impacts of this research will be summarized. The presentation will conclude with overviews of our current research activities in chip interconnect, and our contributions to mechatronics education. |
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Biography I. Charles Ume is a Professor and Director of Instructional Mechatronics, and Advanced Electronic Packaging and Laser Processing Laboratories at the Woodruff School of ME at GIT. He is the Founder and the Chairman of the Board of Directors, AkroMetrix LLC. His research interests are in the areas of thermo-mechanical reliability of electronic systems, laser ultrasound, and intelligent mechatronics. He has published over 200 refereed publications; received four patents and has five utility patents pending; has edited 11 books. He has advised 23 Ph.D. and 21 MS thesis, and 23 non-thesis students. Prof. Ume was a Co-Editor-in-Chief of Mechatronics Journal; Associate Editors of the IEEE Transactions on CPTs and the ASME JEP. He was the General Chair of the 7th Mechatronics Forum International Conference. He is the Chair of the Advisory Board; was the Chair of the Executive Committee; and still a member of the Executive Committee, ASME Electronic and Photonics Packaging Division (EPPD). His former students (2 Ph.D. and 1 MS) have won the Best Sigma Xi Thesis Awards. A few of his selected awards include: ASME-EPPD Best Paper of the Year Award; Instrument, System, and Automation Society E. G. Bailey and Donald P. Eckman Education Awards; GIT Outstanding Interdisciplinary Activities Award; ASEE Robert G. Quinn Award for Excellence in Engineering Education; IEEE-CPMT Outstanding Sustained Technical Contribution Award; Sigma Xi Sustained Research Award; and Fellow of IEEE and ASME |
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