SUMMARY
The need to increase the performance and decrease the cost of the microprocessor, has led semiconductor industry to continuously decrease the feature size and pack more and more transistors on microprocessor. This has not only increased the global heat flux dissipated by the microprocessor, but led to localized regions of very high heat fluxes, called hotspots. Heat flux at these localized hotspots can be five to ten times higher than the average. Temperature at the hotspots can be significantly higher than the average temperature of the die decreasing the performance, reducing the reliability and life of the device. In this project a hybrid cooling scheme to dissipate both the background heat flux, as well as the hotspot power. This scheme combines a solid-state cooling technique using a superlattice cooler (SLC), with a fluidic cooling technique, using a liquid cooled microchannel heat sink. SLC are solid-state active devices which work on Peltier effect. These are silicon micro-fabrication compatible and can remove up to 500 W/cm2 heat flux locally over areas of several hundreds of micrometer diameter. Liquid cooled microchannel heat sinks can readily remove background heat fluxes over 100 W/cm2 over the chip. Integrating the liquid cooled microchannel heat sink and SLC can deliver an effective cooling solution to tackle non-uniform heat flux present over the chip. The hybrid cooling scheme offers several advantages over current state of the art cooling technologies. It offers a power efficient global cooling solution for future high performance devices. It can dynamically adapt to address the power map of electronics devices in real time. It offers fast transient response for better transient performance. It is CMOS compatible allowing it to be easily integrated in the existing fabrication processes. In this project some key issues present in current thermal management techniques has been addressed with the help of hybrid cooling scheme.