SUMMARY
Industries related to automobiles, oil exploration, military hardware and aerospace, often deal with harsh environment (temperatures > 200 0C), which makes it difficult to use conventional electronics for tasks such as performance monitoring, power supply and data acquisition. Commercial-off-the-shelf electronics can survive up to 125 0C, hence the electronics currently used are custom designed and pre-screened for survivability up to the desired temperature and assembled with or without cooling systems that are limited in cooling capacity and/or need to be reset/recharged. This offsets cost benefits and hinders continuous operation for longer durations. High temperature electronics containing materials like Silicon Carbide could provide a solution in future, however immediate concerns could be addressed by compact thermal management techniques that should work without having to be reset and require less maintenance. In this backdrop the proposed research aims at realization of an adsorption based scalable regenerative cooling system for evaporator temperatures above 150 0C, and heat rejection temperature above 200 0C. Adsorption cycle can realize compression with fewer moving parts than a mechanical compressor, and the use of thermoelectric (TE) devices can make heat regeneration possible in a compact set-up. A two-step adsorption cycle is proposed to reduce the comparatively higher temperature variations in the conventional cycle, and an experimental set-up fabricated to realize the system. The research will help in achieving a reliable and compact high temperature cooling system that would extend the working envelope of existing conventional electronics.