SUBJECT: Ph.D. Proposal Presentation
BY: Arkadeep Kumar
TIME: Wednesday, February 22, 2017, 10:00 a.m.
PLACE: MARC Building, 201
TITLE: Surface and Subsurface Damage in Diamond Wire Sawing of Silicon
COMMITTEE: Dr. Shreyes Melkote, Chair (ME)
Dr. Steve Danyluk (ME)
Dr. Richard Neu (ME/MSE)
Dr. Christopher Saldana (ME)
Dr. Chris Arcona (Saint-Gobain)


An impediment to widespread adoption of photovoltaics is the high cost of solar cells, which use single (mono-) or poly (multi-) crystalline silicon wafers as substrates. The wafers are cut from silicon ingots using the wire sawing process, which is an expensive step in the manufacturing process. To make cheaper solar cells, low-cost, thin wafers of superior surface quality and strength are needed. Recent industry trends indicate a shift from the loose abrasive slurry (LAS) sawing to fixed abrasive diamond wire sawing (DWS) process for slicing silicon wafers. DWS offers several advantages including smaller kerf loss, reduced costs, and greater environmental friendliness when compared to the LAS process. However, fundamental research to advance the scientific understanding of DWS is lacking. An open problem in DWS of silicon wafers is how the abrasive grits fixed to the core wire can be engineered to produce favorable surface and subsurface properties, which would reduce processing time and resources in addition to enhancing the mechanical strength of the solar cell substrate. Moreover, cutting multi-crystalline silicon by DWS has known limitation of reduced manufacturing yield. Multi-crystalline silicon is cheaper than mono-crystalline silicon and is therefore expected to increase the adoption of cheaper solar photovoltaic energy. In spite of the advantages of DWS and the low cost of multi-crystalline silicon, lack of fundamental knowledge of the DWS process is a limiting factor for widespread practical use. The goal of this research is to advance the scientific understanding of diamond wire sawing of silicon through fundamental studies of the effects of grit shape, abrasive wear, and silicon microstructure on the resulting surface and subsurface damage. It is expected that the proposed research will provide the knowledge required to guide future development and optimization of the DWS process to cut brittle materials, including multi-crystalline silicon for photovoltaic applications.