SUMMARY

Flexible photovoltaic devices have the potential to be an attractive alternative to conventional PV technologies if they can be made environmentally stable and reliable. Therefore there is a need to develop encapsulation and edge-seal materials that can adequately protect these devices while being compatible in flexible architectures.

In this work, the mass transport and mechanical properties of flexible PV packaging materials are characterized to determine their reliability. Additionally, the impact of environmental aging on the properties were measured in order to determine the implications for device lifetime. This was accomplished using ultra-violet, thermal, and damp heat exposure to simulate actual weathering conditions. The impact of these aging conditions on material adhesion was evaluated and analyzed.