|SUBJECT:||M.S. Thesis Presentation|
|TIME:||Monday, November 21, 2016, 11:30 a.m.|
|PLACE:||MARC Building, 201|
|TITLE:||Effect of Temperature and Humidity Conditioning on Mold Compound/Copper Interfacial Fracture and the Associated Cohesive Zone Models|
|COMMITTEE:||Dr. Suresh K. Sitaraman, Chair (ME)
Dr. Samuel Graham (ME)
Dr. Karl Jacob (ME/MSE)
Microelectronic packages consist of multilayered structures made of dissimilar materials. Interfacial delamination is a common failure mechanism present in microelectronic packages due to the mismatch in the coefficient of thermal expansion (CTE) between different materials. Epoxy Mold Compound (EMC) on a copper leadframe is a common interface found in microelectronic packages. This work analyzes delamination at an EMC/Copper interface and how the interfacial fracture energy is affected by temperature and humidity conditioning. This work employs delamination experiments to determine how the temperature and humidity conditioning will influence the cohesive zone models (CZM).