|SUBJECT:||M.S. Thesis Presentation|
|TIME:||Tuesday, July 24, 2018, 10:00 a.m.|
|PLACE:||Love Building, 210|
|TITLE:||Fin Thermoelectric Cooler Performance Characterization|
|COMMITTEE:||Dr. Shannon Yee, Chair (ME)
Dr. Samuel Graham (ME)
Dr. Todd Sulcheck (ME)
Thermoelectric coolers (TECs) are attractive cooling devices because they have no moving parts and operate without the use of global warming potential (GWP) refrigerants. However, due to a low coefficient of performance (COP) and high system costs, TECs are limited to niche applications such as wine coolers, medical refrigerators, and luxury car seats where cost and efficiency are insensitive. Most thermoelectric (TE) research has been focused on improving TE material properties while neglecting the impact of device architecture on performance. However, recent research indicates that device architecture plays a significant role in device performance. Herein, the extent to which device architecture can improve performance is investigated, specifically via the integration of the thermoelectric elements into the heat exchanger.