|SUBJECT:||M.S. Thesis Presentation|
|TIME:||Wednesday, April 19, 2017, 9:00 a.m.|
|PLACE:||MARC Building, 401|
|TITLE:||Vibration Analysis of Electroplated Copper Compliant Interconnects|
|COMMITTEE:||Dr. Suresh K. Sitaraman, Chair (ME)
Dr. Richard W. Neu (ME)
Dr. Vanessa Smet (ECE)
Microelectronic packaging interconnects are subjected to mechanical damage due to thermal and power cycles, drop impact shock, and various vibration loads during application. As traditional microelectronic packaging interconnects are rigid, compliant interconnects are being pursued to facilitate more independent deformation between the substrate and the die while experiencing lower stress and strain, thus improving the overall mechanical reliability. However, though there have been studies that examine these interconnects under thermal fatigue and drop testing, the literature on vibration loading is scarce.